Mechanic XGZ40 solder paste consists of flux and solder microparticles of 20-38 microns. Suitable for surface soldering and repair of PCB, BGA, SMD, PGA components.
Features
High viscosity. Does not spread when heated
Clean, neat soldering without flux residue
Convenient container with a syringe is convenient for spot application of the paste on the sites
Mostly used for soldering without a soldering iron. You can use a hair dryer, hot table, infrared table and even a gas torch or lighter.
Widely used in radio electronic industry for surface mounting of planar (SMD) components on printed circuit board
Characteristics
Composition: Sn-63%, Pb-37%
Flux: IPX3
Capacity: 10ml
Solder microparticles: 20-38 microns
Melting point: 183 °C
Weight: 35 g
Accessories
1 x Mechanic XGZ40 solder paste
How to use
Pre-cleaned and degreased PCB surface
Position the PCB horizontally
Squeeze some paste onto the soldering area and position the components
Heat the paste. When heated, the flux boils and the Mechanic XGZ40 paste shrinks in size. The solder balls that make up the paste will then begin to melt
After the heating is complete, the paste will solidify within a few seconds.
Photos
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